From single-layer proof-of-concept to 16-layer high-speed production boards — we deliver manufacturing-ready designs with rigorous signal integrity analysis and DFM optimisation.
Full-spectrum PCB design capabilities for any application domain
From 2-layer through to 16-layer stack-ups, with controlled impedance, differential pairs and dedicated power/ground planes for clean power distribution.
DDR3/4, PCIe, USB 3.x, HDMI and Gigabit Ethernet routing with full SI analysis — length matching, diff-pair tuning and crosstalk mitigation.
Sub-GHz, 2.4 GHz, and 5 GHz RF layouts with proper ground stitching, impedance matching networks, and co-planar waveguide transmission lines.
SMPS, DC-DC converters, battery management systems and motor drive boards — designed for thermal efficiency, low EMI and high power density.
IPC-2221 Class 3, AEC-Q qualified component selection, CAN / LIN bus design and wide-temperature-range layouts for harsh environment deployments.
Manufacturing-ready output packages: Gerber X2, ODB++, IPC-2581, assembly drawings, BOM with alternates, pick-and-place files, and test point coverage.
Our typical design capabilities — contact us for project-specific requirements
A structured, review-gated workflow from specification to manufacturing release
We review your electrical requirements, signal types, target fab house capabilities and cost targets to define the optimal layer stack-up and design rules before a single trace is routed.
Full schematic entry with hierarchical sheets, net classes and parametric BOM. Peer-reviewed against the specification with checklist sign-off before moving to layout.
Placement-first approach — critical components (decoupling caps, oscillators, RF sections, high-current paths) placed for electrical performance before aesthetic routing begins.
Critical nets routed first: power planes poured, differential pairs length-matched, high-speed buses verified with impedance simulation. DRC run continuously throughout.
Full DFM audit against target fab tolerances — silkscreen legibility, courtyard violations, pad-to-trace clearances, copper pour islands and testability checks.
Complete fab and assembly package: Gerber X2, drill files, ODB++, IPC-2581, pick-and-place, assembly drawings, final BOM with alternates and revision history.
Every project is delivered as a complete, fab-ready package
Native project files + PDF schematics with full hierarchy and annotation
IPC-7351 compliant Gerbers, Excellon drill files, and ODB++ package
Full BOM with MPN, supplier links, alternates, and cost breakdown
Top/bottom assembly views with component designators and orientation marks
XY coordinate files in IPC-7711/7721 format for SMT assembly machines
Signal integrity simulation results and full DFM audit report
Full board 3D export for mechanical fit-check and enclosure design
Version-controlled design with full change log and git repository access
Industry-standard EDA platforms we work with
Our go-to platform for complex multi-layer PCBs — schematic, layout, simulation and output generation in one unified environment.
Preferred for open-hardware and cost-sensitive projects — full schematic-to-Gerber flow with Python scripting automation.
Used for high-density, high-speed digital designs requiring advanced constraint management and tight SI control.
Analog and mixed-signal circuit simulation for power supply design, filter analysis, and pre-layout verification.
Industry-standard schematic capture and PCB layout for clients requiring OrCAD-format deliverables or mixed-signal simulation.
Share your requirements and our engineers will respond with a detailed technical proposal within 24 hours.
Get a Free Quote